VIA Technologies has announced a new form factor printed circuit board called Em-ITX, designed for developers of embedded systems. The new form factor for 30 percent of compact Mini-ITX and proposes new standards for ultrathin embedded devices.

Despite the small size, Em-ITX gives 200% more space to accommodate the I/O module. When the size of the printed circuit board 12 x 17 cm, this form factor includes a two-edge I / O, as well as Em-IO expansion of bus. According to VIA, this solution increases the flexibility and extensibility of the system. The advantages it also include the reduction of time spent on preliminary development of devices and access to a scalable platform that includes a 64-bit processor VIA Nano.

Built-card-based form factor Em-ITX, can serve as a basis for the establishment of industrial automation devices, digital signaling panels, and other decisions that are required in ultrathin embedded devices. Specifications of the new form factor Em-ITX include the decision, according to which inputs I / O are located along both long edges of the printed circuit board. Such a design reduces the noise arising from the multitude of wires and increases the purity of the signal and improves the air cooling the card. Variants of connectors that can use this scheme include the COM (RS-232/422/485), RJ45, DVI, VGA, LVDS, USB 2.0 and DC. Bus expansion of Em-IO integrates the most popular standards, including USB 2.0, GPIO, LPC, PCIe, IDE, IEEE 1394, SATA, PCI, DVI, HDMI, Gigabit Ethernet and Card Bus.

Products based on form factor Em-ITX, should appear as early as next month.

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VIA unveils a new form factor smaller than Mini-ITX

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VIA’s Em-ITX form factor has I/O on two sides

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