VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems
VIA Technologies has introduced a chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, called VIA AMOS-5000. It is made of steel and it is able to withstand extremes of temperature from minus 20 to plus 55 degrees Celsius, as well as capable of sustaining a g-force of up to 50G. In addition, the AMOS-5000 design makes it easy to install and maintain it.
VIA AMOS-5000 has no active cooling system, fanless. To ensure the normal temperature of system components, it uses separate aluminum radiator, in direct contact with the processor and chipset on the reverse side of the motherboard. In addition, there are many interfaces, the number of which can be increased through expansion modules.
It is assumed that the compact, versatile, fanless, and rugged, the VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems may prove useful in many fields which utilized embedded systems. It can be used, for example, in medicine and health, digital information displays and interactive kiosks, as well as in industrial automation systems and controls.
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VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems
Rugged, versatile and fanless, the VIA AMOS-5000 modular chassis kit leverages dual I/O coastlines for I/O intensive industrial PCs
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